The idea of IoT (Internet of Things) is getting more and more popular, nowadays everything can be connected to the internet. However, portable devices which people wear or carry everyday must be as small as possible.
In order to shrink the size of PCB, PCE offer Via in Pad process to our clients. We fill up the PTHs (Plated Through Holes) with conductive (or non-conductive) epoxy, and copper-plating the surface of each via hole.

Via-In-Pad PCB

Applications & Benefits:

  • Tighter BGA pitches
  • Increased thermal dissipation
  • Reduced layer count or board size, which ultimately may reduce cost
  • Improved routing density (higher density per layer)
  • Strengthening Pad attachment
  • Gives high frequency designs the shortest possible route to bypass capacitors
  • Overcomes high speed design issues and constraints such as low inductance

Rigid PCB Capability

Feature Capability
Lamination Layer count 1-32 layers
Min. thickness 4 mil(0.1 mm)
Max working panel size 24x31.5 inch(610x800mm)
Max. aspect ratio 10:1
Copper Copper Thickness 0.33~3.0 oz (11~105um)
Trace Min. Line Width /Space 3/3 mil
Routing Dimension tolerance +/- 2 mil (0.05mm)
Solder Mask S/M minimum dam width 2.5 mil
Impedance Control Differential pair +/- 10%
Mechanical Drilling Min. drilling hole size 4 mil(0.1mm)
3 Axis Depth control accuracy +/- 2mil (0.05mm)
Material Availability FR-4, High Tg FR-4, Halogen-free FR-4, Metal Core, Low Dk/Df (ISOLA/ Rogers)
Finish Availability Lead-free HASL, HASL, OSP, ENIG, Pattern Gold Plating, Immersion Silver/Tin, Carbon Ink